Kaindl - Properties of HDF Panel

Chipboards have been in use as carrier panels since laminate floorings were first manufactured. However, in recent years the use of chipboards has been decreasing proportionally. Fibre panels, HDF panels in particular are becoming increasingly more popular with their homogeneous structure and the associated compressive strength.

Properties of HDF Panels:

Transverse Stress Resistance
x 1.0 N/mm²
Lifting Strength
x 1.0 N/mm²
Moisture Expansion 24 hours
< 12%
free formaldehyde
Panel Moisture
free of tension

The respective panel offer the following advantages:

HDF Panels:

  • less receptive to moisture by virtue of closed pores
  • higher compressive strength
  • greater stability in groove and tongue areas